PDMS microfluidic chip

PDMS microfluidic chip

2026-08-11 09:18:59
Poly(dimethylsiloxane) (PDMS) Microfluidic Chip Technical Guide
1. Material Overview & Core Properties
1.1 Physical Characteristics
  • High Transparency: Exceptional optical clarity within the 240–1100 nm wavelength range.

  • Gas Permeability: Highly permeable, providing excellent oxygen and carbon dioxide flux.

  • Mechanical Flexibility: Soft elastomer nature ensures high impact resistance and prevents fracture.

  • Thermal Range: Sustains long-term stability in harsh environments from -50°C to 200°C.

  • Cost-Efficiency: Economical material suitable for large-scale replication and prototyping.

1.2 Biomedical Suitability
  • Biocompatibility: Inherently non-toxic and biocompatible.

  • Chemical Inertness: Exhibits high chemical stability under standard conditions.

  • Applications: Ideal for cellular assays, drug screening, cell trapping, and biochemical research.


2. Fabrication Capabilities & Precision Tolerances
2.1 Structural Features & Limits
  • Minimum Feature Size: Resolvable down to 2 μm.

  • Channel Dimensions: Minimum width of 5 μm; minimum height of 10 μm.

  • Feature Spacing: Minimum distance between adjacent channels is 20 μm.

  • Array Fabrication: Supports micro-pillar/micro-well arrays (circular or square) and PDMS 96-well plates.

  • Aspect Ratio Limit: Minimum pillar diameter is 10 μm (Note: For concave molds, the aspect ratio must not exceed 1:1).

2.2 Geometrical Accuracy
  • Channel Height Error: Δ h = ± 5% of the channel height.

  • Feature Height Accuracy: ± 5% of the channel height.

  • Wall Verticality: Side-wall taper profile within ± 3°.

  • Thin Film Control: Thickness ranges 50–500 μm with a strict 2% tolerance.


3. Surface Modification & Chemical Compatibility
3.1 Plasma Oxidation (Hydrophilic Modification)
  • Mechanism: Oxygen plasma alters surface chemistry to generate silanol groups (Si-OH).

  • Hydrophilic Lifetime: Converts native hydrophobic surfaces (water contact angle ~ 108° ± 7°) to hydrophilic for approximately 30 minutes.

  • Anti-Adsorption: Inhibits non-specific adsorption of hydrophobic and negatively charged molecules.

  • Covalent Bonding: Enables surface functionalization via trichlorosilane or atomic-level Si-O-Si covalent bonding to oxidized glass.

3.2 Solvent Compatibility & Swelling Guide
Fluid CategoryRepresentative FluidsPDMS Performance & Recommendation
CompatibleWater, Glycerol, Methanol, EthanolNo penetration or continuous deformation. Safe for use.
MarginalAcetone, Propanol, PyridineMinor swelling and structural deformation. Use with caution.
IncompatibleDiisopropylamine, Chloroform, EthersSevere swelling and geometric distortion. Do not use.

4. Chip Cleaning & Maintenance Protocol
Key Notice: PDMS chips are highly susceptible to chemical contamination, difficult to clean thoroughly, and have low reuse rates. They are primary intended as disposable single-use chips.
4.1 Pre-Experimental Blockage Prevention
  • Filtration Requirement: All solvents must be filtered prior to injection into the system.

  • Critical Channels: Stricter filtration is mandatory for channels under 20 μm to prevent clogging from particulates.

4.2 Post-Experimental Flush Protocol
  1. Purge Residuals: Use strong pressure to push the chemical reagents out of the channels.

  2. Solvent Displacement: Fill the reservoirs with a fluid miscible with the reagent. Flush until droplets emerge from the outlet.

  3. Deionized Water Rinse: Flush thoroughly with DI water.

  4. Gas Desiccation: Purge the channels with air, nitrogen (N₂), oxygen (O₂), or argon (Ar) until completely dry.

4.3 Substrate-Specific Cleaning Guidelines
SubstrateContaminant TypeRecommended Method & Crucial Warnings
PDMSOrganic ResiduesEthanol wash → DI water flush → Bake dry.
PDMSInorganic ResiduesDirect DI water flush → Bake dry.
GlassVarious ResiduesRobust chemical resistance; match solvent to residue. Never use hydrofluoric acid (HF).
PMMAVarious ResiduesTolerates only weak inorganic acids/bases. Organic solvents are strictly prohibited.
  • Operational Warning: Avoid high flow rates during cleaning to prevent delamination or structural damage caused by excessive hydraulic pressure.


5. Optimization Elements for PDMS Bonding
  1. Thermal Curing: Post-bonding baking at 80–90°C for 15–30 minutes significantly enhances bond strength.

  2. Plasma Medium: Ambient room air plasma treatment is sufficient and highly effective for standard bonding routines.

  3. Contamination Control: The PDMS surface must be completely free of dust, lint, and particulate matter before bonding.